Reaction engineering of through-chip via filling for wafer-level 3D packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 638-642

  Barkey, D P ^a   Callahan, J ^b   Keigler, A ^c   Liu, Z ^c   Ruff, A ^b   Trezza, J ^b   Wu, B ^c  

^a UNIVERSITY OF NEW HAMPSHIRE   (United States)

^b Cubic Wafer Inc   (United States)

^c Nexx Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

OXYGEN DIFFUSERS; PROCESS MODELING; ROTATING DISK ELECTRODE (RDE);

COMPUTER SIMULATION; ELECTRODEPOSITION; REDOX REACTIONS;

CHIP SCALE PACKAGES;

EID: 35348891409     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373864     Document Type: Conference Paper

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