Manufacture and metrology of 300 mm silicon wafers with ultra-low thickness variation

AIP Conference Proceedings

Volumn 931, Issue , 2007, Pages 105-110

  Griesmann, Ulf ^a   Wang, Quandou ^a   Tricard, Marc ^b   Dumas, Paul ^b   Hall, Christopher ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b QED TECHNOLOGIES   (United States)

Author keywords

300 mm wafer flatness metrology; Magnetorheological finishing (MRF); Ultra flat wafers

Indexed keywords

EID: 35348864360     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2799352     Document Type: Conference Paper

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