Response spectra analysis for transient structural responses of board-level electronic packages subjected to half-sine impact acceleration pulses

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 81-88

  Yeh, Chang Lin ^a   Tsai, Tsung Yueh ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY RESPONSE; IMPACT TESTING; SOLDERED JOINTS; SPECTRUM ANALYSIS; STRAIN MEASUREMENT; WAVEFORM ANALYSIS;

DEGREES OF FREEDOM STRUCTURAL SYSTEMS; JEDEC DROP TESTING; RESPONSE SPECTRA SOLUTIONS;

CHIP SCALE PACKAGES;

EID: 33847286922     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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