Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 4, 2007, Pages 306-312

  Yim, Myung Jin ^a   Chung, Chang Kyu ^b   Paik, Kyung Wook ^b  

^a Georgia Institute of Technology   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive film (ACF); Chip on glass (COG); Contact resistance; Failure analysis; Reliability

Indexed keywords

ANISOTROPY; CONTACT RESISTANCE; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC PROPERTIES; FAILURE ANALYSIS; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; RELIABILITY;

ANISOTROPIC CONDUCTIVE FILM; CHIP ON GLASS; CONDUCTIVE PARTICLE PROPERTIES;

CONDUCTIVE FILMS;

EID: 35348816197     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.906496     Document Type: Article

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