Influence of rapid cooling and diffusion annealing on Sn-Bi-X solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 17, Issue 8, 2007, Pages 1319-1323

  Li, Yuan Shan ^a,b   Chen, Zhen Hua ^a   Lei, Xiao Juan ^a  

^a HUNAN UNIVERSITY   (China)

^b NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY   (China)

Author keywords

Diffusion anneal; Rapid cooling; Segregation; Sn Bi lead free solders

Indexed keywords

ANNEALING; BISMUTH ALLOYS; COOLING; EUTECTICS; MECHANICAL PROPERTIES; MELT SPINNING; MELTING POINT; MICROSTRUCTURE; SEGREGATION (METALLOGRAPHY); TIN ALLOYS;

DIFFUSION ANNEALING; RAPID COOLING; TIN BISMUTH LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 35248812482     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Wood E P, Nimmo K L. In search of new lead-free electronic solders[J]. J Electron Mater 1994, 23(8): 709-713.
2. Zeng K, Tu K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J]. Materials Science and Engineering, 2002, 38(1): 55-105.
3. Tu K N, Gusak A M, Li M. Physics and materials challenges for lead free solders[J]. Journal of Applied Physics, 2003, 93(3): 1335-1338.
4. Xia Z D, Chen Z G, Shi Y W, et al. Effect of rare earth element addition on the microstructure and mechanical properties of tin-sliver-bismuth solder[J]. J Electron Mater, 2002, 31(6): 564-567.
5. Suganuma K. Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J]. Scripta Materialia, 1998, 138(9): 1333-1340.
6. Suganuma K. Technology of lead free soldering[M]. Beijing: Science Press, 2004: 51-144.
7. LI Yuan-shan, LEI Xiao-juan, CHEN Zhen-hua. A novel low melting point Pb-free solder[J]. Circuits Assembly, 2007, 18(2): 54-57.
8. Suganuma K. Lift-off phenomenon in wave soldering[J]. Acta Materialia, 2000(48): 4475-4481.
9. HE Peng, ZHAO Zhi-li, QIAN Yi-yu. Fillet-lifting phenomenon of wave soldering with Sn-Bi-Ag-Cu solder[J]. The Chinese Journal of Nonferrous Metals, 2005, 15(7): 993-999.
10. Vincent J H, Humpston G. Lead-free solders for electronic assembly[J]. GEC Journal of Research, 1994, 11(2): 76-89.
11. HE Peng, ZHAO Zhi-li, QIAN Yi-yu, et al. Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering[J]. The Chinese Journal of Nonferrous Metals, 2006, 16(2): 315-321.
12. Suganuma K. Application of lead-free in electrical machine and electronic parts[J]. Electronic Technology, 2000(3): 47-53.
13. DUAN Li-lei, YU Da-quan, ZHAO Jie. Microstructures of Sn-9Zn-3Bi solder/Cu joint during long-term aging at 170°C[J]. The Chinese Journal of Nonferrous Metals, 2004, 14(5): 842-847.
14. LIU Chun-zhong, ZHANG Wei, SUI Man-ling. Bi segregation at interface of the eutectic SnBi/Cu solder joint[J]. Acta Metallurgica Sinica, 2005, 41(8): 847-852.