Fillet-lifting phenomenon of wave soldering with Sn-Bi-Ag-Cu solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 15, Issue 7, 2005, Pages 993-999

  He, Peng ^a   Zhao, Zhi Li ^b   Qian, Yi Yu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Crystal crack; Lead free wave soldering; Lift off; Segregation

Indexed keywords

EID: 23944501018     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)