Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 2, 2006, Pages 315-321

  He, Peng ^a   Zhao, Zhi Li ^b   Qian, Yi Yu ^a   Li, Zhong Suo ^c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c Sun East Technology (Holdings) Ltd   (China)

Author keywords

Crystalline crack; Fillet lifting; Lead free wave soldering; Segregation; Su Bi Ag Cu solder

Indexed keywords

AGGLOMERATION; BISMUTH; COPPER; CRACK INITIATION; CRACK PROPAGATION; CRACKS; CRYSTALLIZATION; MATHEMATICAL MODELS; PLASTICITY; SEGREGATION (METALLOGRAPHY); SHRINKAGE; SILVER; SOLDERED JOINTS; STRAIN; STRESS CONCENTRATION; TIN;

CRYSTALLINE CRACK; FILLET LIFTING; LEAD FREE WAVE SOLDERING; STRESS-STRAIN CONCENTRATION; SU-BI-AG-CU SOLDER;

SOLDERING;

EID: 33646508784     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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