A novel low melting point Pb-free solder

Circuits Assembly

Volumn 18, Issue 2, 2007, Pages 54-57

  Li, Yuanshan ^a   Lei, Xiaojuan ^b   Chen, Zhenhua ^b  

^a NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY   (China)

^b HUNAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33847729895     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. Cynthia Williams, "NEMI's Lead-Free Assembly Project Reports Latest Results," IPC Apex Proceedings, January 2002.
2. D.W. Bergman, "NCMS Lead-Free Solder Project," Journal of SMT, February 2000.
3. Soldertec, Second European Lead-free Soldering Technology Roadmap, February 2003.
4. Katsuaki Suganuma, "Current Lead-free Soldering in Japan," http://www.nepss.org/presentations/SEMI_Europe/leadfreesolderingjapan.pdf, 1998.
5. Katsuaki Suganuma, Technology of Lead Free Soldering [M]. (in Chinese), Beijing: Science Publishing Co., 2004. pp. 26-56.