ACLV driven double-patterning decomposition with extensively added printing assist features (PrAFs)

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6520, Issue PART 2, 2007, Pages

  Meiring, Jason E ^a   Haffner, Henning ^b   Fonseca, Carlos ^a   Halle, Scott D ^a   Mansfield, Scott M ^a  

^a IBM   (United States)

^b INFINEON TECHNOLOGIES   (United States)

Author keywords

ACLV; Decomposition; Double exposure; Double patterning; PrAF; RET; SRAF

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; LINEWIDTH; OPTICAL RESOLVING POWER; OPTIMAL SYSTEMS; OPTIMIZATION;

DOUBLE EXPOSURE; DOUBLE PATTERNING; PRINTING ASSIST FEATURES (PRAFS); SUBRESOLUTION ASSIST FEATURES (SRAFS);

PHOTOLITHOGRAPHY;

EID: 35148890325     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.712558     Document Type: Conference Paper

References (5)

1. Owe-Yang, D.; Yu, S. S.; Chen, H.; Chang, C. Y.; Ho, B.; Lin, J. C. and Lin, B. J., "Double exposure for the contact layer of the 65-nm node," Proc. SPIE 5753, 171-180 (2005).
2. Manakli, S.; Trouiller, Y.; Toublan, O.; Schiavone, P.; Rody, Y. F. and Goirand, P. J., "Complementary Double Exposure Technique (CODE) solutions to the two-dimensional structures of the 90nm node" BACUS 4889, 1181-1188 (2002).
3. Trouiller, Y.; Belledent, J.; Chapon, J. D.; Rousset, V.; Rody, Y. F.; Manakli, S. & Goirand, P., "Gate imaging for 0.09-nm logic technology: comparison of single exposure with assist bars and the CODE approach," Proc. SPIE 5040, 1231-1240, (2003).
4. Manakli, S.; Trouiller, Y.; Toublan, O.; Schiavone, P.; Rody, Y. F. & Goirand, P. J., "Using the CODE technique to print complex two-dimensional structures in a 90-nm ground rule process," Design and Process Integration for Microelectronic Manufacturing 5042, 205-213, (2003).
5. Nakao, S.; Narimatsu, K.; Miyagi, T.; Ogawa, S.; Tamada, N.; Nakae, A.; Tokui, A.; Tsujita, K.; Arimoto, I. and Wakamiya, W., "Innovative imaging of ultrafine line without using any strong RET," Proc. SPIE 4346, 503-514 (2001).