Effect of solvents and cross-link reaction group concentration on via filling performance in gap fill materials

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6519, Issue PART 2, 2007, Pages

  Takei, Satoshi ^a   Sakaida, Yasushi ^a   Shinjo, Tetsuya ^a  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

Author keywords

Dual damascene; Gap fill materials; Lithography; Planarization; Thermal cross link materials; Voids free

Indexed keywords

COPPER; CROSSLINKING; ETCHING; LITHOGRAPHY; SOLVENTS; SUBSTRATES;

DUAL DAMASCENE; GAP FILL MATERIALS; PLANARIZATION; THERMAL CROSSLINK MATERIALS;

PHOTORESISTS;

EID: 35148827445     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.711308     Document Type: Conference Paper

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