Effects of Cu and Cu/Ti interlayer on adhesion of diamond film

Surface and Coatings Technology

Volumn 202, Issue 1, 2007, Pages 180-184

  Huang, Yangfeng ^a   Xiao, Hanning ^a   Ma, Zhibin ^b   Wang, Jianhua ^b   Gao, Pengzhao ^a  

^a HUNAN UNIVERSITY   (China)

^b WUHAN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Adhesion; Diamond film; Interlayer; Microwave plasma CVD

Indexed keywords

ADHESION; COPPER; GRAIN GROWTH; INDENTATION; MICROSTRUCTURE; MORPHOLOGY; NUCLEATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

FILM ADHESION; FILM/SUBSTRATE INTERFACE;

DIAMOND FILMS;

ADHESION; COPPER; DIAMOND FILMS; GRAIN GROWTH; INDENTATION; MICROSTRUCTURE; MORPHOLOGY; NUCLEATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 34948895512     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.05.014     Document Type: Article

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