Bump thermal management analysis of LED with flipchip package

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Min, Sizong ^a   Li, Junhui ^a   Duan, Ji An ^a   Deng, Guiling ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; TEMPERATURE CONTROL;

BUMP THERMAL MANAGEMENT ANALYSIS; FLIPCHIP PACKAGE; LED FLIPCHIP;

LIGHT EMITTING DIODES;

EID: 34948877983     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359651     Document Type: Conference Paper

References (17)

1. x junctions," Appl. Phys. Lett., vol. 1, pp. 82-83, 1962. [A reference to a journal article ... ]
2. Stephen Johnson, "LEDs - An Overview of the State of the Art in Technology and Application," Light Right 5 Conference, May 27-31, 2002, Nice, France. [A reference to a presentation at a Conference ... ]
3. Jeff Y. Tsao, "Light Emitting Diodes (LEDs) for General Illumination," Optoelectronics Industry Development Association, Washington, DC, 2002. [A reference to a presentation at a Conference ... ]
4. Lumileds Lighting U.S., LLC, "The Emergence of LEDs - Luminance to Illumination," www.luxeon.com. [A reference to a document of a company ... ]
5. Arik M, Pet roski J, Weaver S. "Thermal challenges in the future generation solid state lighting applications: light emitting diodes." ASME/ IEEE International Packaging Technical Conference . Hawaii, 2001. [A reference to a presentation at a Conference ... ]
6. Arik M, Weaver S. "Chip scale thermal management of high brightness L ED packages." Proc. of SPIE, 2004, 5530: 214-223. [A reference to a journal article]
7. Arik M, Becker C, Weaver S, "Thermal management of L EDs: package to system." Proc. of SPIE, 2004, 5187: 64-75. [A reference to a journal article ... ]
8. Lighting Research and Development Building Technologies Program Office of Energy Efficiency and Renewable Energy U.S. Department of Energy, "Solid-State Lighting Program Planning Workshop Report," February 3-4, 2005 San Diego, California. [A reference to a presentation at a Conference ... ]
9. Lumileds Lighting U.S., LLC, "Thermal Design Using Luxeon Power Light Sources, Application Brief AB05," www.luxeon.com. [A reference to a document of a company ...]
10. Soon-Ho Choi, Shigeo Maruyama, "Thermal boundary resistance at an epitaxially perfect interface of thin films," International Journal of Thermal Sciences 44 (2005) 547-558. [A reference to a journai article ... ]
11. J. Cook, Y. Joshi, and R. Doraiswami, "Interconnect Thermal Management of High Power Packaged Electronic Architectures," Annual IEEE Semiconductor Thermal Measurement and Management Symposium-Proceedings 2004, Vol. 20, 30-37, 2004. [A reference to a presentation at a Conference ... ]
12. Lee T S, "Finite element modeling of three-dimensional solder joint geometry in SMT," J. Electron. Pack. 1997, 119-25. [A reference to a journal article ... ]
13. Pang JHL and Chong DYR, "Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models," IEEE Transaction on advanced packaging, Vol. 24, No. 4, November 2001. [A reference to a journal article ...]
14. Lumileds Lighting U.S., LLC, "Assembly Information Luxeon Emitter, Application Brief AB10," www.luxeon.com. [A reference to a document of a company ... ]
15. R. V. Steele, "High-brightness LED market overview," Proc. SPIE, vol. 4445, 2001, pp. 1-4. [A reference to a journal article ...]
16. J. J. Wierer, D. A. Steigerwald, and M. R. Krames, "High-power Al-GaInN flip-chip light-emitting diodes," Appl. Phys. Lett., vol. 78, p.3379, 2001. [A reference to a journal article ... ]
17. Yang Shiming, Tao Wenquan, Heat transfer, 3E, Higher Education Press of China, 7-04-006693-9, 1998-12-01 [A book reference ... ]