Microelectronic package characterisation using scanning acoustic microscopy

NDT and E International

Volumn 40, Issue 8, 2007, Pages 609-617

  Zhang, Guang Ming ^a   Harvey, David M ^a   Braden, Derek R ^b  

^a LIVERPOOL JOHN MOORES UNIVERSITY   (United Kingdom)

^b Delphi Electronics and Safety   (United Kingdom)

Author keywords

Integrity analysis; Microelectronic package; Scanning acoustic microscopy; Sparse representation

Indexed keywords

ACOUSTIC MICROSCOPES; ACOUSTIC SIGNAL PROCESSING; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT; QUALITY CONTROL; ULTRASONIC EFFECTS;

INTEGRITY ANALYSIS; MICROELECTRONIC PACKAGE; SCANNING ACOUSTIC MICROSCOPY; SPARSE REPRESENTATION;

MICROELECTRONICS;

EID: 34848912254     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ndteint.2007.05.002     Document Type: Article

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