Critical issues in thin layer acoustic image interpretation and metrology for microelectronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 205-218

  Canumalla, Sridhar ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Acoustic microscopy; Metrology; Pulse distortion and delamination; Pulsed ultrasound; Thin layers

Indexed keywords

ACOUSTIC IMAGING; ACOUSTIC MICROSCOPES; CRACKS; DELAMINATION; FREQUENCY DOMAIN ANALYSIS; INTERFACES (MATERIALS); MOISTURE; TIME DOMAIN ANALYSIS; ULTRASONIC WAVES;

ULTRASONIC PULSES;

MICROELECTRONICS;

EID: 0036287156     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. Application of highly focused, high frequency transducers for evaluation of near-surface flaws and thin packages: Smart cards, Flip chip, Flex circuits and Thick films
2. Materials characterization by ultrasonics
3. The application of scanning acoustic microscopy to control moisture/thermal induced package defects
4. High frequency ultrasonic testing of bonds: Application to silicon power devices
5. Towards a nondestructive procedure for characterization of molding compounds
6. Nondestructive elastic property characterization of IC encapsulants
7. Metrology of thin layers in IC packages using an acoustic microprobe: Bondline thickness
8. Ultrasonic measurement of thin layers
9. Ultrasonic nondestructive evaluation of thin (sub-wavelength) coatings
10. The angular and frequency characteristics of reflectivity from a solid layer embedded between two solids with imperfect boundary conditions
11. Changing states of delamination between molding compound and chip surface: A challenge for acoustic microscopy
12. New findings in the occurrence of false-healing in plastic encapsulated microcircuits using scanning acoustic microscopy
13. A study on warpage of flexible SS substrates for large area MCM-D packaging
14. Characterization of thin layers in microelectronic packaging using acoustic microscopy
15. Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer selection
16. Metrology of adhesive layers using acoustic microscopy
17. Nondestructive methodology for Standoff height measurement of flip chip on flex by SAM
18. Speed of sound in pure water