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Volumn 40, Issue 6, 2004, Pages 399-400
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High-resolution AMI technique for evaluation of microelectronic packages
a a b |
Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
FREQUENCY DOMAIN ANALYSIS;
FREQUENCY MODULATION;
MICROELECTRONICS;
PRINTED CIRCUIT BOARDS;
TIME DOMAIN ANALYSIS;
TRANSDUCERS;
ACOUSTIC MICRO-IMAGING;
MICROELECTRONIC PACKAGES;
TIME-FREQUENCY ATOMIC IMAGING;
ULTRASONIC PULSES;
ACOUSTIC IMAGING;
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EID: 1842854612
PISSN: 00135194
EISSN: None
Source Type: Journal
DOI: 10.1049/el:20040267 Document Type: Article |
Times cited : (9)
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References (3)
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