Deformation of bowed silicon chips due to adhesion and applied pressure

Journal of Adhesion Science and Technology

Volumn 21, Issue 11, 2007, Pages 1021-1043

  Pamp, Andy ^a   Adams, George G ^a  

^a Northeastern University   (United States)

Author keywords

Adhesion; Elastic plates; Nanomanufacturing; Wafer bonding

Indexed keywords

ADHESION; BENDING STRENGTH; PRESSURE EFFECTS; SILICON WAFERS; WAFER BONDING;

APPLIED PRESSURE; BENDING MOMENT; ELASTIC PLATES; NANOMANUFACTURING;

MICROPROCESSOR CHIPS;

EID: 34848882232     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856107782105963     Document Type: Article

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