Copper metallization for power devices

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2007, Pages 259-262

  Robl, W ^a   Melzl, M ^a   Weidgans, B ^a   Hofmann, R ^a   Stecher, M ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTROPLATING; METALLIZING; POWER ELECTRONICS; THICKNESS MEASUREMENT;

PATTERN PLATING; POWER DEVICES; THICKNESS DISTRIBUTION;

COPPER;

EID: 34748829076     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2007.375112     Document Type: Conference Paper

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