Thermal stability of NiPt- and Pt-silicide contacts on SiGe source/drain

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2547-2551

  Demeurisse, C ^a   Verheyen, P ^a   Opsomer, K ^a   Vrancken, C ^a   Absil, P ^a   Lauwers, A ^a  

^a IMEC   (Belgium)

Author keywords

Ni silicide; NiPt alloy; Pt; SiGe; Thermal stability

Indexed keywords

ANNEALING; DEGRADATION; ELECTRON MICROSCOPY; MORPHOLOGY; NICKEL; PLATINUM; SHEET RESISTANCE;

GERMANOSILICIDE PHASE FORMATION; MORPHOLOGICAL DEGRADATION;

THERMODYNAMIC STABILITY;

EID: 34548815383     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.065     Document Type: Article

References (7)

1. Zhang S.-L. Microelectr. Eng. 70 (2003) 174-185
2. Lauwers A., Van Dal M.J.H., Verheyen P., Chamirian O., Demeurisse C., Mertens S., Vrancken C., Verheyden K., Funk K., and Kittl J.A. Microelectr. Eng. 83 11-12 (2006) 2268-2271
3. J.A. Kittl, A. Lauwers, O. Chamirian, M. Van Dal, A. Akheyar, O. Richard, M. de Potter, R. Lindsay, K. Maex, in: Proceedings of the 203rd Meeting of the Electrochemical Society April 27-May 2, 2003, Paris, France, pp. 177-183.
4. Chamirian O., Lauwers A., Kittl J.A., Van Dal M., de Potter M., Lindsay R., and Maex K. Micorelectr. Eng. 76 (2004) 297-302
5. Mangelinck D., Dai J.Y., Pan J.S., and Lahiri. Appl. Phys. Lett. 75 (1999) 1736
6. Wang R.N., and Feng J.Y. J. Phys.: Condens. Matter. 15 (2003) 1935-1942
7. Seger J., and Zhang S.-L. Appl. Phys. Lett. 81 (2002) 1978-1980