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Volumn , Issue , 2007, Pages 78-85

Macro-model for post-breakdown 90NM and 130NM transistors and ITS applications in predicting chip-level function failure after ESD-CDM events

Author keywords

Chip level function failure prediction; ESD CDM; Inductive coupling; Post breakdown transistor macro model

Indexed keywords

COMPUTER SIMULATION; ELECTRIC BREAKDOWN; FAILURE ANALYSIS; MATHEMATICAL MODELS;

EID: 34548811999     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2007.369872     Document Type: Conference Paper
Times cited : (4)

References (10)
  • 1
    • 70450209973 scopus 로고    scopus 로고
    • A New Mechanism for Core Device Failure During CDM ESD Events
    • C. Ito, W. Loh, "A New Mechanism for Core Device Failure During CDM ESD Events," Proc. EOS/ESD Symposium, 2006, pp. 8-13.
    • (2006) Proc. EOS/ESD Symposium , pp. 8-13
    • Ito, C.1    Loh, W.2
  • 2
    • 33747806926 scopus 로고    scopus 로고
    • Post-breakdown leakage resistance and its dependence on device area
    • T, W. Chen, C. Ito, W. Loh, "Post-breakdown leakage resistance and its dependence on device area," Proc. ESREF, 2006, pp. 1612-1615.
    • (2006) Proc. ESREF , pp. 1612-1615
    • Chen, T.W.1    Ito, C.2    Loh, W.3
  • 3
    • 0037972834 scopus 로고    scopus 로고
    • Collapse of MOSFET drain current alter soft breakdown and its dependence on transistor aspect ratio W/L
    • A. Cester, S. Cimino, A. Paccagnella, G. Ghidini, G. Guegan, "Collapse of MOSFET drain current alter soft breakdown and its dependence on transistor aspect ratio W/L," Proc. IRPS, 2003, pp. 189-195.
    • (2003) Proc. IRPS , pp. 189-195
    • Cester, A.1    Cimino, S.2    Paccagnella, A.3    Ghidini, G.4    Guegan, G.5
  • 5
    • 0036927324 scopus 로고    scopus 로고
    • Statistically independent soft breakdowns redefine oxide reliability specifications
    • M.A. Alam, R. K. Smith, B. E. Weir, P. J. Silverman, "Statistically independent soft breakdowns redefine oxide reliability specifications," IEDM, 2002, pp. 151-154.
    • (2002) IEDM , pp. 151-154
    • Alam, M.A.1    Smith, R.K.2    Weir, B.E.3    Silverman, P.J.4
  • 6
    • 34548779996 scopus 로고    scopus 로고
    • Field-induced Charged-Device Model test method for Electrostatic-Discharge-Withstand thresholds of microelectronic components
    • JEDEC
    • JEDEC, "Field-induced Charged-Device Model test method for Electrostatic-Discharge-Withstand thresholds of microelectronic components," JESD22- C101C, 2004.
    • (2004) JESD22- C101C


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.