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Volumn 46, Issue 9-11, 2006, Pages 1612-1616

Post-breakdown leakage resistance and its dependence on device area

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ELECTRIC BREAKDOWN; ELECTRIC RESISTANCE; LEAKAGE CURRENTS; VOLTAGE MEASUREMENT;

EID: 33747806926     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.044     Document Type: Article
Times cited : (5)

References (18)
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    • Sune J., Miranda E., Nafria M., and Aymerich X. Modeling the breakdown spots in silicon dioxide films as point contacts. Applied Physics Letters 75 7 (1999)
    • (1999) Applied Physics Letters , vol.75 , Issue.7
    • Sune, J.1    Miranda, E.2    Nafria, M.3    Aymerich, X.4
  • 3
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    • Are soft breakdown and hard breakdown of ultrathin gate oxides actually different failure mechanisms?
    • Sune J., Mura G., and Miranda E. Are soft breakdown and hard breakdown of ultrathin gate oxides actually different failure mechanisms?. IEEE Elec Dev Letters 21 4 (2000)
    • (2000) IEEE Elec Dev Letters , vol.21 , Issue.4
    • Sune, J.1    Mura, G.2    Miranda, E.3
  • 4
    • 34250751272 scopus 로고    scopus 로고
    • Ramadurai V, Rohrer N, Gonzalez C. SRAM operational voltage shifts in the presence of gate oxide defects in 90nm SOI. Proc IRPS, p. 270-3, 2006.
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    • 3042654612 scopus 로고    scopus 로고
    • Kaczer B, De Keersgieter A, Mahmood S, Degraeve R, Groseneken G. Impact of gate-oxide breakdown of varying hardness on narrow and wide NFET's. Proc IRPS, p. 79-83, 2004.
  • 6
    • 84955296083 scopus 로고    scopus 로고
    • Rodriguez R, Stathis JH, Linder BP. Modeling and experimental verification of the effect of gate oxide breakdown on CMOS inverters. Proc. IRPS, p. 11-6, 2003.
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    • 3042652187 scopus 로고    scopus 로고
    • Kaczer B, Degraeve R, Augendre E, Jurczak M, Groseneken G. Experimental verification of ARAM cell functionality after hard and soft gate oxide breakdowns. ESSDERC Proc, p. 75-8, 2003.
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    • Kaczer B, Degraeve R, De Keersgieter A, Van de Mieroop K, Bearda T, Groseneken G. Consistent model for short-channel nMOSFET post- hard-breakdown characteristics. Proc VLSI Symp, p. 121-2, 2001.
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    • 34250698964 scopus 로고    scopus 로고
    • Okada K, Horikawa T, Satake H, Ota H, Ogawa A, Nabatame T, Toriumi A. Mechanism of gradual increase of gate current in high-k gate dielectrics and its application to reliability assessment. Proc IRPS, p. 189-94, 2006.
  • 13
    • 77950838428 scopus 로고    scopus 로고
    • Li J, Hyvonen S, Rosenbaum E. Improved wafer- level VFTLP system and investigation of device turn- on effects. Proc EOS/ESD Symposium, 2004.
  • 14
    • 33747765678 scopus 로고    scopus 로고
    • Field-induced Charged-Device Model test method for Electrostatic-Discharge-Withstand thresholds of microelectronic components
    • JEDEC. Field-induced Charged-Device Model test method for Electrostatic-Discharge-Withstand thresholds of microelectronic components. JESD22-C101C (2004)
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    • Crupi F, Kaczer B, Degraeve R, De Keersgieter A, Groseneken G. Location and hardness of the oxide breakdown in short channel n- and p-MOSFETs. Proc IRPS, p. 55-9, 2002.
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    • Lombardo S, Crupi F, Stathis JH. Softening of breakdown in ultra-thin gate oxide nMOSFETs at low inversion layer density. Proc IRPS, p. 163-7, 2001.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.