Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1779-1783

  Lhommeau, T ^a,b,c   Perpina X ^b   Martin, C ^a   Meuret, R ^c   Mermet Guyennet, M ^b   Karama, M ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b ALSTOM   (France)

^c SAFRAN AIRCRAFT ENGINES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE ENGINEERING; SOLDERING ALLOYS; TEMPERATURE DISTRIBUTION; THERMAL FATIGUE;

IGBT MODULES; TEMPERATURE CYCLING;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

EID: 34548736004     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.093     Document Type: Article

References (8)

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