Analysis of 3d conjugate heat transfers in electronics

Proceedings of the 1997 European Conference on Design and Test, EDTC 1997

Volumn , Issue , 1997, Pages 190-194

  Fradin, J P ^a   Molla, L ^a   Desaunettes, B ^a  

^a Epsilon Ingenierie California V 5   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TRANSFER; SAILING VESSELS;

CONJUGATE HEAT TRANSFER; ELECTRONIC DEVICE; FINITE METHODS; SCIENTIFIC RESEARCHES; BOUNDARY-ELEMENT METHODS; MULTI CHIP MODULES;

BOUNDARY ELEMENT METHOD;

EID: 51049102536     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/edtc.1997.582357     Document Type: Conference Paper

References (7)

1. Sugavanam R.; Ortega A.; Choi C, "Numerical Investigation of Conjugate Heat Transfert from a Flush Heat Source on a Conductive Board in Laminar Channel Flow", Int. J. of Heat and Mass Transf, Vol.38, No. 16; pp 2969-2984;. Nov 1995.
2. J.P. Fradin and B. Desaunettes., "REBECA-3D : The Software for Conductive Fluxes and Temperature Fields Prediction", 26th ices, Monterey, July 8-11, 1996.
3. J.P. Fradin and B. Desaunettes - "Calculations of the Temperature Distribution Throughout Electronic Equipments by the B.E.M. with the REBECA-3D Software", Eurotherm 45 : Thermal Management of electronic Systems, Sept 1995.
4. Technical documentation of FLUENT.
5. B. Fourka & J.B. Saulnier, The Multigrid Technique : An Efficient Tool for the Analysis of 3D Conjugate Heat Transfert in Electronic Boards, Eurotherm Seminar 36, Poitiers, 1994.
6. L. Molla, Etude du couplage thermique conductif-convectif, Sept. 1996, EPSILON Ing. RE001/STA/0996/LM/1.0.
7. J.J. Vullierme, R. Zugari, Etude numerique et experimental du CPGA180, L.E.T., Alcatel Espace, 1995.