Improvement of fatigue life of solder joints by thickness control of solder with wire bump technique

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1469-1474

  Hayashi, Kenichi ^a   Izuta, Goro ^a   Murakami, Kohei ^a   Uegai, Yasumi ^a   Takao, Haruo ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC SUBSTRATES;

CERAMIC MATERIALS; CRACK PROPAGATION; ELASTOPLASTICITY; FATIGUE OF MATERIALS; HEAT RESISTANCE; SOLDERING ALLOYS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

SOLDERED JOINTS;

EID: 0036287853     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008300     Document Type: Conference Paper

References (3)

1. Soft solder die bonding of multiple die devices
2. Packaging factors affecting the fatigue life of power transistor die bonds
3. Design of reliable die attach