메뉴 건너뛰기




Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1735-1740

Characterization and modelling of ageing failures on power MOSFET devices

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALUMINUM; DELAMINATION; ELECTRON MICROSCOPY; FAILURE ANALYSIS; METALLIZING;

EID: 34548692772     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.055     Document Type: Article
Times cited : (27)

References (12)
  • 1
    • 0038452347 scopus 로고    scopus 로고
    • Reliability aspects of microsensors and micromechatronic actuators for automotive applications
    • Muller-Fiedler R., and Knoblauch V. Reliability aspects of microsensors and micromechatronic actuators for automotive applications. Microelectronics Reliability 43 7 (2003) 1085
    • (2003) Microelectronics Reliability , vol.43 , Issue.7 , pp. 1085
    • Muller-Fiedler, R.1    Knoblauch, V.2
  • 2
    • 24144443892 scopus 로고    scopus 로고
    • Innovative methodology for predictive reliability of intelligent power devices using extreme electrothermal fatigue
    • Khong B., Tounsi P., Dupuy P., Chauffleur X., et al. Innovative methodology for predictive reliability of intelligent power devices using extreme electrothermal fatigue. Microelectronics and Reliability 45 9-11 (2005) 1717
    • (2005) Microelectronics and Reliability , vol.45 , Issue.9-11 , pp. 1717
    • Khong, B.1    Tounsi, P.2    Dupuy, P.3    Chauffleur, X.4
  • 3
    • 24144461658 scopus 로고    scopus 로고
    • Assessment of the Trench IGBT reliability: low temperature experimental characterization
    • Azzopardi S., Benmansour A., Ishiko M., and Woirgard E. Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectronics and Reliability 45 9-11 (2005) 1700
    • (2005) Microelectronics and Reliability , vol.45 , Issue.9-11 , pp. 1700
    • Azzopardi, S.1    Benmansour, A.2    Ishiko, M.3    Woirgard, E.4
  • 4
    • 33846611982 scopus 로고    scopus 로고
    • Reliability study of power RF LDMOS device under thermal stress
    • Belaid M.A., Ketata K., Mourgues K., Gares M., et al. Reliability study of power RF LDMOS device under thermal stress. Microelectronics Journal 38 2 (2007) 164
    • (2007) Microelectronics Journal , vol.38 , Issue.2 , pp. 164
    • Belaid, M.A.1    Ketata, K.2    Mourgues, K.3    Gares, M.4
  • 5
    • 33747757647 scopus 로고    scopus 로고
    • Investigation of MOSFET failure in soft-switching conditions
    • Iannuzzo F., Busatto G., and Abbate C. Investigation of MOSFET failure in soft-switching conditions. Microelectronics and Reliability 46 9-11 (2006) 1790
    • (2006) Microelectronics and Reliability , vol.46 , Issue.9-11 , pp. 1790
    • Iannuzzo, F.1    Busatto, G.2    Abbate, C.3
  • 6
    • 29244484255 scopus 로고    scopus 로고
    • Design concept for wire-bonding reliability improvement by optimizing position in power devices
    • Ishiko M., Usui M., Ohuchi T., and Shirai M. Design concept for wire-bonding reliability improvement by optimizing position in power devices. Microelectronics Journal 37 3 (2006) 262
    • (2006) Microelectronics Journal , vol.37 , Issue.3 , pp. 262
    • Ishiko, M.1    Usui, M.2    Ohuchi, T.3    Shirai, M.4
  • 7
    • 34548660638 scopus 로고    scopus 로고
    • Khong B, Legros M, Dupuy P, Levade C, Vanderschaeve G. Alterations induced in the structure of intelligent power devices by extreme electro-thermal fatigue, Physica Status Solidi (C), in press.
  • 8
    • 0024766321 scopus 로고
    • Mechanical properties of thin films
    • Nix W.D. Mechanical properties of thin films. Metallurgical Transactions A 20A (1989) 2217-2245
    • (1989) Metallurgical Transactions A , vol.20 A , pp. 2217-2245
    • Nix, W.D.1
  • 9
    • 0036681512 scopus 로고    scopus 로고
    • Microstructural evolution in passivated Al films on Si substrates during thermal cycling
    • Legros M., Hemker K.J., Gouldstone A., Suresh S., et al. Microstructural evolution in passivated Al films on Si substrates during thermal cycling. Acta Materialia 50 13 (2002) 3435
    • (2002) Acta Materialia , vol.50 , Issue.13 , pp. 3435
    • Legros, M.1    Hemker, K.J.2    Gouldstone, A.3    Suresh, S.4
  • 10
    • 34548668274 scopus 로고    scopus 로고
    • Legros M, Dehm G, Balk TJ, Arzt E, et al. Plasticity-related phenomena in metallic films on substrates. in: Multiscale Phenomena in Materials Experiments and Modeling Related to Mechanical Behavior, 2003, San Francisco.
  • 11
    • 0033677268 scopus 로고    scopus 로고
    • Structure evolution during processing of polycrystalline films
    • Thompson C.V. Structure evolution during processing of polycrystalline films. Annual Review of Materials Science 30 (2000) 159-190
    • (2000) Annual Review of Materials Science , vol.30 , pp. 159-190
    • Thompson, C.V.1
  • 12
    • 0032684355 scopus 로고    scopus 로고
    • Crack-like grain-boundary diffusion wedges in thin metal films
    • Gao H., Zhang L., Nix W.D., Thompson C.V., and Arzt E. Crack-like grain-boundary diffusion wedges in thin metal films. Acta Materialia 47 10 (1999) 2865-2878
    • (1999) Acta Materialia , vol.47 , Issue.10 , pp. 2865-2878
    • Gao, H.1    Zhang, L.2    Nix, W.D.3    Thompson, C.V.4    Arzt, E.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.