Resist removal by using wet ozone

Journal of Photopolymer Science and Technology

Volumn 20, Issue 2, 2007, Pages 315-318

  Horibe, Hideo ^a   Yamamoto, Masashi ^a   Ichikawa, Tomokazu ^b   Kamimura, Tomosumi ^c   Tagawa, Seiichi ^d  

^a KANAZAWA INSTITUTE OF TECHNOLOGY   (Japan)

^b KOCHI NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^c OSAKA INSTITUTE OF TECHNOLOGY   (Japan)

^d OSAKA UNIVERSITY   (Japan)

Author keywords

Chemicals; Environment; Removal; Resist; Resist implanted ions; Wet ozone

Indexed keywords

EID: 34548635733     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.20.315     Document Type: Article

References (8)

1. Gardner,W.L.; Baddorf,A.R; Holber,W.M., J.Vac.Sci.Technol., 1997, A15(3), 1409-1412.
2. Omiya,K,; Kataoka,Y., J.Electrochem.Soc., 1998, 145(12), 4323-4327.
3. Huynh,C.K,; Mitchener,J.C., J.Vac.Sci.Technol, 1991,B9(2),353-356.
4. DeGendt,S.; Snee,P.; Cornelissen,I.;Lux,M.; Vos,R.: Mertens,P.W.; Knotter, D.M., Meuris,M.; Heyns,M., Solid State Phenomena, 1998, 65/66, 165-168.
5. Wolke,K.; Riedel,T.; Haug,R.;De Gendt,S.; Heyns,M.M.;Meuris,M., In Proc.of Electrochem.Soc.PV, 1999; pp 204-211.
6. Riedel,T.; Wolke,K.; De Gendt,S.; Onsia,B., Solid State Phenomena, 2001, 76/77, 227-230.
7. Abe,H.; Iwamoto,H.; Toshima,T.; Iino, T.InProc.of the 11st International Symposium on Semiconductor Manufacturing (Tokyo, Japan, 2002), 199-202.
8. Noda,S.; Miyamoto, M.; Horibe, H.; Oya, I.; Kuzumoto,M.; Kataoka,T. J.Electrochem. Soc., 2003, 150(9).