Plating of copper layers on polyimides using electroless plating by surface modification

Surface Review and Letters

Volumn 14, Issue 4, 2007, Pages 593-596

  Ji, Eun Sun ^a   Kim, Young Hwan ^a   Kang, Yong Cheol ^a   Kang, Young Soo ^a   Ahn, Byung Hyun ^a  

^a Pukyong National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; ELECTROLESS PLATING; POLYIMIDES; POLYMER FILMS; SURFACE PROPERTIES; SURFACE TREATMENT;

CONTACT ANGLE MEASUREMENTS; COPPER LAYERS;

COPPER;

EID: 34548383860     PISSN: 0218625X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0218625X07009724     Document Type: Conference Paper

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