A simple model-based approach for fluid dispensing analysis and control

IEEE/ASME Transactions on Mechatronics

Volumn 12, Issue 4, 2007, Pages 491-503

  Li, Han Xiong ^a,b   Liu, J ^c   Chen, C P ^d   Deng, Hua ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b CENTRAL SOUTH UNIVERSITY   (China)

^c NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY   (China)

^d HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Modeling and control; Numerical simulation; Steady unsteady flow; Time pressure dispensing

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FLOW CONTROL; NEWTONIAN FLOW; PIPE FLOW;

FLUID DISPENSING; MODEL-BASED RUN-BY-RUN CONTROL; TIME-PRESSURE DISPENSING;

STEADY FLOW;

EID: 34548364206     PISSN: 10834435     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMECH.2007.901946     Document Type: Article

References (28)

1. A. Koide, Y. Sasaki, Y. Yoshimura, R. Miyake, and T. Terayama, "Micromachined dispenser with high flow rate and high resolution," in Proc. 13th Annu. Int. Conf.Micro ElectroMech. Syst., Jan. 23-27, 2000, pp. 424-428.
2. A. Lewis and A. Babiarz, "Conductive adhesive dispensing process considerations," in Proc. Tech. Prog. Nat. Electr. Packag. Prod. Conf. (West, East), 1999, pp. 335-349.
3. S. R. Marongelli, D. Dixon, and S. Porcari et al., "Practical production uses of SMT adhesives," in Proc. IEEE/CPMT Int. Electron. Manuf. Technol. (IEMT) Symp., 1998, pp. 147-155.
4. R. Bush, "Matching fluid dispensing to materials for electronics applications," Electron. Packag. Prod., vol. 37, pp. 56-62, 1997.
5. D. Dixon et al., "Practical issues concerning dispensing pump technologies," Circuits Assembly, pp. 36-40, Aug. 1997.
6. I. Fidan et al., "Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system," IEEE Trans. Compon., Packag. Manuf. Technol. C, vol. 21, no. 3, pp. 172-181, Jul. 1998.
7. H. Quinones, A. J. Babiarz, and S. J. Adamson, "Flip chip and chip scale packaging technologies: A historical perspective and future challenges," presented at the SEMICON 2000 China Tech. Symp., Prague, Czech Republic, 2000.
8. J.-P. Li and G. L. Deng, "Technology development and basic theory study of fluid dispensing: A review," in Proc. 6th IEEE CPMT Conf. High Density Microsyst. Des. Packag. Compon. Failure Anal., Jun. 30-Jul. 3, 2004, pp. 198-205.
9. X. B. Chen, W. J. Zhang, G. Schoenau, and B. Surgenor, "Off-line control of time-pressure dispensing processes for electronics packaging," IEEE Trans. Electron. Packag. Manuf., vol. 26, no. 4, pp. 286-293, Oct. 2003.
10. R. Burga and A. Tausek, "Control of adhesive dispensing parameters during transition from research to production environments," in Proc. 2003 5th Conf. Electron. Packag. Technol. (EPTC 2003), Dec. 10-12, 2003, pp. 671-674.
11. C. Q. Ness and A. R. Lewis, "Adhesives/epoxies and dispensing," Surf. Mount Technol. (SMT), pp. 114-122, May 1998.
12. W. Schafer, F. Elling, and E. Dosch, "Dispensing: How to increase accuracy and speed," Eur. Coatings J., no. 6, pp. 610-613, 1997.
13. Y.-P. Hong and H.-X. Li, "Comparative study of fluid dispensing modeling," IEEE Trans. Electron. Packag. Manuf., vol. 26, no. 4, pp. 273-280, Oct. 2003.
14. P. Kropp, "Problems with high speed adhesive dispensing," in Proc. 7th Int. SAMPE Electron. Conf., 1994, pp. 487-493.
15. A. Razban, "Intelligent control of an automated adhesive dispensing cell" Ph.D. dissertation, Imperial College, London, U.K., 1993.
16. A. Razban and B. L. Davies, "Analytical modelling of the automated dispensing of adhesive materials," J. Adhesion Sci. Technol., vol. 9, pp. 1435-1450, 1995.
17. R. P. Chhabra and J. F. Richardson, Non-Newtonian Flow in the Process Industries: Fundamentals and Engineering Applications. Oxford, U.K.: Butterworth-Heinemann, 1999.
18. A. Razban,O. S. Sezgin, and B. L. Davies, "Real time control of automated adhesive dispensing," in Proc. 3rd Int. Conf. Softw. Eng. Real Time Syst., Cirencester, U.K., 1991, pp. 145-150.
19. R. Chandraker, A. A. West, and D. J. Williams, "The knowledge based control of adhesive dispensing for surface mount device assembly," IEEE Trans. Compon., Hybrids Manuf. Technol., vol. 13, no. 3, pp. 516-520, Sep. 1990.
20. R. Spinazzola, "Statistical process control applied to automated dispense of silver filled epoxy for commercial millimetre wave multi chip module," in Proc. IEEE Int. Conf. Multichip Modules, Apr. 1997, pp. 228-233.
21. H. X. Li, S. K. Tso, and H. Deng, "A conceptual approach to integrate design and control for the epoxy dispensing process," Adv. Manuf. Technol., vol. 17, pp. 677-682, 2001.
22. X. B. Chen, G. Schoenau, and W. J. Zhang, "Modeling of time-pressure fluid dispensing processes," IEEE Trans. Electron. Packag. Manuf. vol. 23, no. 4, pp. 300-305, Oct. 2000.
23. X. B. Chen, G. Schoenau, and W. J. Zhang, "Modeling and control of dispensing processes for surface mount technology," IEEE/ASME Trans. Mechatron., vol. 10, no. 3, pp. 326-334, Jun. 2005.
24. O. Kolditz, Computational Methods in Environmental Fluid Mechanics New York: Springer-Verlag, 2002.
25. C. L. Tucker, Fundamentals of Computer Modeling for Polymer Processing. Munich, Germany: Hanser, 1989.
26. J. H. Ferziger and M. Peric, Computational Methods for Fluid Dynamics 3rd ed. New York: Springer-Verlag, 2002.
27. Y. P. Chen and R. A. Ralconer, "Advection-diffusion modeling using the modified QUICK scheme," Int. J. Numer. Methods Fluids, vol. 15, pp. 1171-1196, 1992.
28. H. Deng and H. X. Li, "A novel neural approximate inverse control for unknown nonlinear discrete dynamical systems," IEEE Trans. Syst., Man, Cybern. B, Cybern., vol. 35, no. 1, pp. 115-123, Feb. 2005.