Adhesives/epoxies & dispensing

SMT Surface Mount Technology Magazine

Volumn 12, Issue 5, 1998, Pages 114-122

  Ness, Christian Q ^a   Lewis, Alan R ^a  

^a Asymtek Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPUTER AIDED DESIGN; JET PUMPS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; STRENGTH OF MATERIALS;

ADHESIVE DISPENSING; GREEN STRENGTH;

SURFACE MOUNT TECHNOLOGY;

EID: 1242350432     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Surface Mount Design and Land Pattern Standard, IPC, 1996.
2. Alec. J. Babiarz, "Adhesive Dispensing for Surface Mount Assembly", Printed Circuit Assembly, July 1989.
3. F. Murch, D. Dixon and M. Davis, "Issues for the Practical Production Use of Dispensing Technologie," NEPCON West 1997 Proceedings.
4. Vern Soiberg, "Board Preparation," SMT Magazine, February 1994, p. 40-46.
5. Ken Gilleo, "Adhesives/Eposies & Dispersing," SMT Magazine, April 1994, p. 54-61.
6. E. Austin and A.R. Lewis, "Is Your Solder Paste Dispersable?" SMT Magazine, July 1996, p. 42-45.