Thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 63-69

  Hu, Xuejiao ^a   Jiang, Linan ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

Author keywords

CNT composite; Contact thermal resistance; Die attach material; Electronic packaging; Site bond percolation; Thermal conductivity

Indexed keywords

CARBON NANOTUBES; ELECTRONICS PACKAGING; HEAT FLUX; HEAT RESISTANCE; INTEGRATED CIRCUITS; INTERFACES (MATERIALS);

CONTACT THERMAL RESISTANCE; DIE ATTACH MATERIALS; SITE BOND PERCOLATION; WETTING PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 4444375416     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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