Viscoelastic effect of FR-4 material on packaging stress development

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 3, 2007, Pages 411-420

  Kim, Yeong K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

FR 4; Packaging stress; Reliability analysis; Viscoelasticity

Indexed keywords

FORTRAN (PROGRAMMING LANGUAGE); GLASS FIBERS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; RELIABILITY ANALYSIS; STRESS RELAXATION; TEMPERATURE; VISCOELASTICITY;

BOARD ON CHIP (BOC); PACKAGING STRESS; PACKAGING STRESS DEVELOPMENT; PACKAGING STRUCTURE;

ELECTRONICS PACKAGING;

EID: 34548169622     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.901294     Document Type: Article

References (24)

1. T. M. Wang, I. M. Daniel, and J. T. Gotro, "Thermoviscoelastic analysis of residual stresses ans warpage in composite laminates," J. Comp. Mater., vol. 26, pp. 883-899, 1992.
2. P. Shrotriya and N. R. Sottos, "Creep and relaxation behavior of woven glass/epoxy substrates for multilayer circuit board application," Polym. Comp., vol. 19, pp. 567-578, 1998.
3. P. Shrotriya and N. R. Sottos, "Local time-temperature-dependent deformation of a woven composite," Exp. Mech., vol. 44, pp. 336-353, 2004.
4. P. Shrotriya and N. R. Sottos, "Viscoelastic response of woven composite substrate," Comp. Sci. Technol., vol. 65, pp. 621-634, 2005.
5. Q. Zhu, P. Shrotriya, N. R. Sottos, and P. H. Geubelle, "Three-dimensional viscoelastic simulation of woven composite substrates for multiplayer circuit boards," Comp. Sci. Technol., vol. 63, pp. 1971-1983, 2003.
6. ANSYS, Theory Manual.
7. Personal communication with ABAQUS® program engineer.
8. L. Nallainathan, X. Mu, W. Chiu, and R. Jones, "Modelling orthotropic viscoelastic behavior of composite laminates using a coincident element method," Polym. Polym. Comp., vol. 11, pp. 669-677, 2003.
9. N. G. McCrum, C. P. Buckley, and C. B. Bucknell, Principles of Polymer Engineering. Oxford, U.K.: Oxford Univ. Press, 1988.
10. R. L. Taylor, K. S. Pister, and G. L. Goudreas, "Thermochemical analysis of viscoelastic solids," Int. J. Numer. Methods Eng., vol. 2, pp. 45-59, 1970.
11. K. Y. Lin and I. H. Hwang, "Thermo-viscoelastic analysis of composite materials," J. Comp. Mater., vol. 23, pp. 554-569, 1989.
12. S. R. White and Y. K. Kim, "Process-induced residual stress analysis of AS4/3501-6 composite material," Mech. Comp. Mater. Struct., vol. 5, pp. 153-186, 1998.
13. R. M. Christensen, Theory of Viscoelasticity. New York: Academic, 1971.
14. J. L. Abot and I. M. Daniel, "Through-thickness mechanical characterization of woven fabric composites," J. Comp. Mater., vol. 38, pp. 543-553, 2004.
15. N. R. Sottos, J. M. Ockers, and M. Swindeman, "Thermoelastic properties of plain weave composites for multilayer circuit board applications," J. Electron. Packag., vol. 121, pp. 37-43, 1999.
16. N. K. Naik and P. S. Shembekar, "Elastic behavior of woven fabric composites: I-lamina analysis," J. Comp. Mater., vol. 26, pp. 2196-2225, 1992.
17. R. Pandey and H. T. Hahn, "A micromechanical model for 2D fabrics," in Proc. Amer. Soc. Composites 9th Technical Conf., Lancaster, PA, Oct. 13-15, 1994,, pp. 359-368.
18. O. E. Seifert, S. C. Schumacher, and A. C. Hansen, "Viscoelastic properties of a glass fabric composite at elevated temperatures: Experimental and numerical results," Comp.B-Eng., vol. 34, pp. 571-586, 2003.
19. J. M. Whitney and R. L. McCullough, "Micromechanical materials modeling," in Delaware Composites Design Encyclopedia. Lancaster, PA: Technomic, vol. 2.
20. TA Instruments, Inc., Thermal Analysis & Rheology Application Library RS-23 1999.
21. Personal communication with Engineers in Loctite®.
22. Y. K. Kim and I. M. Daniel, "Cure cycle effect on composite structures manufactured by resin transfer molding," J. Comp. Mater., vol. 36, pp. 1725-1743, 2004.
23. M. Y. Tsai, C. H. Hsu, and C. N. Han, "A note on suhir's solution of thermal stresses for a die-substrate assembly," J. Electron. Packag. vol. 126, pp. 115-119, 2004.
24. E. Suhir, "Stresses in bi-metal thermostats," ASME J. Appl. Mech. vol. 53, pp. 657-660, 1986.