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Volumn 44, Issue 4, 2004, Pages 336-353

Local time-temperature-dependent deformation of a woven composite

Author keywords

Creep and stress relaxation; Moir interferometry; Multilayer circuit boards; Textile composites; Time temperature dependent response; Woven composite

Indexed keywords

DEFORMATION; FABRICS; INTERFEROMETRY; MULTILAYERS; STRAIN; TENSILE TESTING; THERMAL EFFECTS; WEAVING;

EID: 3943113062     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1177/0014485104044314     Document Type: Article
Times cited : (8)

References (14)
  • 1
    • 0033098259 scopus 로고    scopus 로고
    • Thermoelastic properties of plain weave composites for multilayer circuit board applications
    • Sottos, N.R., Ockers, J.M., and Swindeman, M., "Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications," Journal of Electronic Packaging, 121, 37-43 (1999).
    • (1999) Journal of Electronic Packaging , vol.121 , pp. 37-43
    • Sottos, N.R.1    Ockers, J.M.2    Swindeman, M.3
  • 2
    • 0027663573 scopus 로고
    • Thermal-mechanical strain characterization for printed wiring boards
    • Wu, T.Y., Guo, Y., and Chen, W.T., "Thermal-Mechanical Strain Characterization for Printed Wiring Boards," IBM Journal of Research and Development, 37, 621-634 (1993).
    • (1993) IBM Journal of Research and Development , vol.37 , pp. 621-634
    • Wu, T.Y.1    Guo, Y.2    Chen, W.T.3
  • 3
    • 0027575462 scopus 로고
    • The in-plane thermal expansion of glass fabric reinforced epoxy laminates
    • Yuan, J. and Falanga, L.A., "The In-Plane Thermal Expansion of Glass Fabric Reinforced Epoxy Laminates," Journal of Reinforced Plastics and Composites, 12, 489-496 (1993).
    • (1993) Journal of Reinforced Plastics and Composites , vol.12 , pp. 489-496
    • Yuan, J.1    Falanga, L.A.2
  • 4
    • 0026759099 scopus 로고
    • Thermoviscoelastic analysis of residual stresses and warpage in composite laminates
    • Wang, T.M., Daniel, I.M., and Gotro, J.T., "Thermoviscoelastic Analysis of Residual Stresses and Warpage in Composite Laminates," Journal of Composite Materials, 26, 883-899 (1992).
    • (1992) Journal of Composite Materials , vol.26 , pp. 883-899
    • Wang, T.M.1    Daniel, I.M.2    Gotro, J.T.3
  • 5
    • 0032178644 scopus 로고    scopus 로고
    • Creep and relaxation behavior of woven glass/epoxy substrates for multilayer circuit board applications
    • Shrotriya, P. and Sottos, N.R., "Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications," Polymer Composites, 19, 567-578 (1998).
    • (1998) Polymer Composites , vol.19 , pp. 567-578
    • Shrotriya, P.1    Sottos, N.R.2
  • 6
    • 0031625632 scopus 로고    scopus 로고
    • Elastic response of porous matrix plain weave fabric composites. I. modeling
    • Kuhn, J.L. and Charalambides, P.G., "Elastic Response of Porous Matrix Plain Weave Fabric Composites. I. Modeling," Journal of Composite Materials, 32, 1426-1471 (1998).
    • (1998) Journal of Composite Materials , vol.32 , pp. 1426-1471
    • Kuhn, J.L.1    Charalambides, P.G.2
  • 7
    • 0031634020 scopus 로고    scopus 로고
    • Elastic response of porous matrix plain weave fabric composites. II. results
    • Kuhn, J.L. and Charalambides, P.G., "Elastic Response of Porous Matrix Plain Weave Fabric Composites. II. Results," Journal of Composite Materials, 32, 1472-1507 (1998).
    • (1998) Journal of Composite Materials , vol.32 , pp. 1472-1507
    • Kuhn, J.L.1    Charalambides, P.G.2
  • 8
    • 0031378807 scopus 로고    scopus 로고
    • Modelling for predicting the mechanical properties of textile composites - A review
    • Tan, P., Tong, L., and Steven, G.P., "Modelling for Predicting the Mechanical Properties of Textile Composites - A Review," Composites Part A, 28A, 903-922 (1997).
    • (1997) Composites , vol.28 A , Issue.PART A , pp. 903-922
    • Tan, P.1    Tong, L.2    Steven, G.P.3
  • 11
    • 0028992134 scopus 로고
    • The use of moire interferometry as an aid to standard test-method development for textile composite materials
    • Ifju, P.G., Masters, J.E., and Jackson, W.C., "The Use of Moire Interferometry as an Aid to Standard Test-Method Development for Textile Composite Materials," Composites Science and Technology, 53, 155-163 (1995).
    • (1995) Composites Science and Technology , vol.53 , pp. 155-163
    • Ifju, P.G.1    Masters, J.E.2    Jackson, W.C.3
  • 12
    • 3943077130 scopus 로고    scopus 로고
    • Masters Thesis, Theoretical and Applied Mechanics Department, University of Illinois at Urbana-Champaign
    • Stout, E.A., "Characterization of Electronic Packaging Using Moire Interferometry," Masters Thesis, Theoretical and Applied Mechanics Department, University of Illinois at Urbana-Champaign (1997).
    • (1997) Characterization of Electronic Packaging Using Moire Interferometry
    • Stout, E.A.1
  • 13
    • 0042101735 scopus 로고    scopus 로고
    • PhD Dissertation, Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign
    • Shrotriya, P., "Dimensional Stability of Multilayer Circuit Boards," PhD Dissertation, Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign (2000).
    • (2000) Dimensional, Stability of Multilayer Circuit Boards
    • Shrotriya, P.1
  • 14
    • 0041422544 scopus 로고    scopus 로고
    • Viscoelastic response of a woven composite substrate for multilayer circuit board applications
    • Zhu, Q., Shrotriya, P., Geubelle, P.H., and Sottos, N.R., "Viscoelastic Response of a Woven Composite Substrate for Multilayer Circuit Board Applications," Composite Science and
    • (2003) Composite Science and Technology , vol.63 , pp. 1971-1983
    • Zhu, Q.1    Shrotriya, P.2    Geubelle, P.H.3    Sottos, N.R.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.