Creep and relaxation behavior of woven glass/epoxy substrates for multilayer circuit board applications

Polymer Composites

Volumn 19, Issue 5, 1998, Pages 567-578

  Shrotriya, P ^a   Sottos, N R ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTICITY; EPOXY RESINS; MATHEMATICAL MODELS; RELAXATION PROCESSES; RHEOLOGY;

DYNAMIC MECHANICAL ANALYSIS (DMA); THERMORHEOLOGY; TIME TEMPERATURE SUPERPOSITION PRINCIPLE;

GLASS FIBER REINFORCED PLASTICS;

EID: 0032178644     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10130     Document Type: Article

References (25)

1. R. Holmes, IPC Printed Circuit Expo 1996, Northbrook, Illinois (1996).
2. N. R. Sottos, J. M. Ockers, and M. Swindeman, J. Electronic Packaging, in press (1998).
3. T. Y. Wu, Y. Guo, and W. T. Chen, IBM J. Res. Develop., 37, 621 (1993).
4. J. Yuan and L. A. Falanga, J. Reinf. Plast. Compos., 12, 489 (1993).
5. T. M. Wang, I. M. Daniel, and J. T. Gotro, J. Compos. Mater., 26, 883 (1992).
6. M. Y. M. Chiang, G. B. McKenna, and J. Yuan, Polym. Eng. Sci., 34, 1815 (1994).
7. Y. Weitsman, J. Appl. Mech., 46, 583 (1979)
8. S. Roy and J. N. Reddy, Computers & Structures, 29, 1011 (1988)
9. Y. K. Kim and S. R. White, Polym. Eng. Sci., 36, 2852 (1996).
10. R. L. Taylor, K. S. Pister, and G. L. Goudreau, Int. J. Num. Meth. Eng., 2, 45 (1970).
11. S. R. White and Y. K. Kim, J. Compos. Mater., in press (1997).
12. J. M. Whitney and R. L. McCullough, Micromechanical Material Modeling, Delaware Composites Design Encyclopedia, Vol. 2, Technomic Publishing Co., Lancaster, Pennsylvania (1990).
13. S. Govindrajan, N, A. Langrana, and G. J. Weng, Polym Compos., 17, 353 (1996).
14. T. Ishikawa and T.-W. Chou, J. Compos. Mater., 16, 2 (1982).
15. T. Ishikawa and T.-W. Chou, J. Mater. Sci., 17, 3211 (1982).
16. T. Ishikawa and T.-W. Chou, AIAA J., 21, 1714 (1983).
17. T. Ishikawa and T.-W. Chou, J. Compos. Mater., 17, 92 (1983).
18. N. K. Naik and P. S. Shembekar, J. Compos. Mater., 26, 2196 (1992).
19. N. K. Naik and P. S. Shembekar, J. Compos. Mater., 26, 2522 (1992).
20. N. K. Naik and P. S. Shembekar, J. Compos. Tech. Res., 15, 34 (1993).
21. P. S. Shembekar and N. K. Naik, J. Compos. Mater., 26, 2226 (1992).
22. P. S. Shembekar and N. K. Naik, J. Compos. Tech. Res., 15, 23 (1993).
23. J. W. Lee and C. E. Harris, J. Compos. Mater., 22, 717 (1988).
24. R. A. Schapery, "Viscoelastic Behavior and Analysis of Composite Materials," in Composite Materials, Vol. 2, Academic Press, New York (1974).
25. G. J. Jarzebski, PhD dissertation, University of Delaware, Department of Chemical Engineering (1982).