Capacity evaluation of a MEMS based micro cooling device using liquid metal as coolant

Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

Volumn , Issue , 2006, Pages 1311-1315

  Deng, Zhong Shan ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

Chip cooling; High heat flux; Liquid metal; MEMS; Numerical simulation

Indexed keywords

COMPOSITE MICROMECHANICS; COOLING; FLUIDS; HEAT SINKS; HEATING EQUIPMENT; LIQUID METALS; LIQUIDS; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MOLECULES; NEMS; QUENCHING; THREE DIMENSIONAL;

(ITER) HIGH HEAT FLUX; ACTIVE COOLING SUBSTRATE; COOLING CAPABILITY; COOLING DEVICES; COOLING FLUIDS; ELECTRONIC COMPONENTS; ELECTRONIC DEVICES; HEAT TRANSFER PROCESS; HIGH CAPACITY (TRANSMISSION DATA RATE); IN ORDER; INTERNATIONAL CONFERENCES; MEMS DEVICES; MICRO COOLING; MICRO SYSTEMS (CO); MOLECULAR SYSTEMS; OPERATING TEMPERATURES; SENSORS AND ACTUATORS; SMALL SCALE APPLICATIONS; THREE DIMENSIONAL (3D); WORKING FLUIDS (WF);

COOLING SYSTEMS;

EID: 34547936228     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2006.334738     Document Type: Conference Paper

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