MEMS-enabled thermal management of high-heat-flux devices EDIFICE: Embedded droplet impingement for integrated cooling of electronics

Experimental Thermal and Fluid Science

Volumn 25, Issue 5, 2001, Pages 231-242

  Amon, Cristina H ^a   Murthy, Jayathi ^a   Yao, S C ^a   Narumanchi, Sreekant ^a   Wu, Chi Fu ^a   Hsieh, Cheng Chieh ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; COOLING; ELECTRONIC EQUIPMENT; VAPORIZATION;

DROPLET IMPINGEMENT;

FLUIDS;

COOLING; FLOW VISUALIZATION; HEAT FLUX; MATHEMATICAL MODELING; MICROELECTRONICS;

EID: 0035504771     PISSN: 08941777     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0894-1777(01)00071-1     Document Type: Article

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