Active cooling substrates for thermal management of microelectronics

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 477-483

  Wang, Yong ^a,b   Yuan, Guang ^c   Yoon, Yong Kyu ^c   Allen, Mark G ^a,c   Bidstrup, Sue Ann ^a  

^a Georgia Institute of Technology   (United States)

^b PRAXAIR INC   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Active cooling substrate; Electromagnetic actuator; Printed wiring board (PWB); Synthetic jet; Thermal management

Indexed keywords

ACTUATORS; COOLING; FLOW CONTROL; HEAT CONVECTION; JETS; MICROELECTROMECHANICAL DEVICES; PRINTED CIRCUIT BOARDS; SUBSTRATES; THERMAL VARIABLES CONTROL;

ACTIVE COOLING SUBSTRATE; ELECTROMAGNETIC ACTUATOR; SYNTHETIC JET; THERMAL MANAGEMENT;

MICROELECTRONICS;

EID: 27644500192     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848575     Document Type: Article

References (11)

1. P. Gelsinger, "Microprocessors for the millennium: Challenges, opportunities, and new frontiers," in Proc. 2001 IEEE Int. Solid-State Circuits Conf., Feb. 2001, pp. 22-25.
2. D. Steinberg, Cooling Techniques for Electronic Equipment. New York: Wiley, 1991.
3. R. Tummala, Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.
4. B. Smith and A. Glezer, "The formation and revolution of synthetic jets," Phys. Fluids, vol. 10, pp. 2281-2297, Sep. 1998.
5. O. Savas and D. Coles, "Coherence Measurements in synthetic turbulent boundary layers," J. Fluid Mech., vol. 160, pp. 421-446, May 1985.
6. M. Giovanni, Flat and Corrugated Diaphragm Design Handbook. New York: Marcel Dekker, 1982.
7. Y. Wang, S. Bidstrup, G. Yuan, and M. Allen, "Printed-wiring-board microfluidics for thermal management of electronic systems," in Proc. ECS'02 Int. Symp., May 2002, pp. 161-170.
8. Y. Wang, G. Yuan, Y. Yoon, M. Allen, and S. Bidstrup, "A MEMS active cooling substrate for microelectronics thermal management," presented at the Proc. ASME Int. Mechanical Engineering Congress R&D Expo, Nov. 2003.
9. A. Sedra and K. Smith, Microelectronic Circuits. New York, NY: Oxford Univ. Press, 1998.
10. Y. Yoon and M. Allen, "Pt heater/sensor microarray for distributed nuidic cooling assessment," in Proc. ASME IMECE/MEMS'01, New York, NY, Nov. 2001.
11. S. Kim and S. Lee, Air Cooling Technology for Electronic Equipment. Boca Raton, FL: CRC, 1996.