Numerical evaluation on the heat dissipation capability of liquid metal based chip cooling device

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 511-515

  Deng, Zhong Shan ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP COOLING METHOD; MICROELECTRONIC INDUSTRY; THERMAL MANAGEMENT;

COMPUTATION THEORY; COOLING SYSTEMS; ELECTRONICS INDUSTRY; LIQUID METALS; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS;

HEAT LOSSES;

EID: 33645075728     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-80189     Document Type: Conference Paper

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