Porous ultra low k deposited by PECVD: From deposition to material properties

Surface and Coatings Technology

Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 9248-9251

  Jousseaume, V ^a   Favennec, L ^b   Zenasni, A ^a   Gourhant, O ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

Deposition; FTIR; Porous dielectric; Thin film

Indexed keywords

DIELECTRIC DEVICES; MICROELECTRONICS; POROSITY; POROUS MATERIALS; SPIN COATING; THIN FILMS;

MICROELECTRONIC INTERCONNECTION; POROUS DIELECTRIC;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

DIELECTRIC DEVICES; MICROELECTRONICS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POROSITY; POROUS MATERIALS; SPIN COATING; THIN FILMS;

EID: 34547686648     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.04.105     Document Type: Article

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