Study of plasma mechanisms of hybrid a-SiOC:H low-k film deposition from decamethylcyclopentasiloxane and cyclohexene oxide

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 416-421

  Castex, A ^a   Favennec, L ^b   Jousseaume, V ^c   Bruat, J ^a   Deval, J ^a   Remiat, B ^c   Passemard, G ^b   Pons, M ^d  

^a AIR LIQUIDE   (France)

^b STMICROELECTRONICS   (France)

^c CEA LETI   (France)

^d UNIV GRENOBLE ALPES   (France)

Author keywords

D5; Fragmentation; Mass spectroscopy; PECVD; Porogen

Indexed keywords

DIELECTRIC FILMS; DISSOCIATION; ELLIPSOMETRY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MASS SPECTROMETRY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

D5; FRAGMENTATION; POROGEN;

SILICON COMPOUNDS;

EID: 28044448084     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.025     Document Type: Conference Paper

References (8)

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