Rapid laser-beam reflowing of Pb-free solder foils

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 140-142

  Herbert, F ^a   Dorn, L ^a   Shrestha, S ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; HEAT RESISTANCE; LASER BEAM EFFECTS; LEAD ALLOYS; METALLIZING; NEODYMIUM LASERS; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING; WETTING;

GRAIN REFINEMENT; LASER-BEAM REFLOWING;

SOLDERING ALLOYS;

EID: 0035008258     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)