High-speed experimental results for an adhesive-bonded superconducting multi-chip module

IEEE Transactions on Applied Superconductivity

Volumn 17, Issue 2, 2007, Pages 971-974

  Kaplan, Steven B ^a,b   Dotsenko, Vladimir ^b   Tolpygo, Diana ^b  

^a IEEE   (United States)

^b HYPRES INC   (United States)

Author keywords

Chip to chip communications; Cryogenic package; Multi chip module; Superconducting

Indexed keywords

BUMP CHARACTERISTICS; CRYOGENIC PACKAGES; MULTI CHIP MODULES (MCM); SUPERCONDUCTING CIRCUITRY;

ADHESIVES; CRYOGENICS; DATA COMMUNICATION SYSTEMS; DATA TRANSFER; MEASUREMENT ERRORS; SUPERCONDUCTING DEVICES; SUPERCONDUCTIVITY; THERMAL CYCLING;

MICROPROCESSOR CHIPS;

EID: 34547459601     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2007.897376     Document Type: Conference Paper

References (15)

1. A. Brown, "An overview of Josephson packaging," IBM J. Res. Develop., vol. 24, pp. 1.67-171, May 1980.
2. L. F. Miller, IBM J. Res. Develop., vol. 13, pp. 239-250, May 1969.
3. M. B. Ketchen, D. J. Herrell, and C. J. Anderson, "Josephson. cross-sectional model experiment," J. Appl. Phys., vol. 57, pp. 2550-2573, April 1985.
4. For a review, cf. K. Likharev and V. Semenov, "RSFQ logic/memory family: A new Josephson-junction technology for sub-terahertz-clock-frequency digital systems," IEEE Trans. Appl. Supercond., vol. 1, pp. 3-28, March 1992.
5. M. Maezawa, H. Yamamori, and A. Shoji, "Chip-to-chip communication using a single flux quantum pulse," IEEE Trans. Appl. Supercond., vol. 10, pp. 1603-1605, June 2000.
6. D. Gupta, W. Li, S. B. Kaplan, and I. V. Vernik, "High-speed interchip data transmission technology for superconducting multi-chip modules," IEEE Trans. Appl. Supercond., vol. 11, pp. 731-734, June 2001.
7. Q. P. Herr, A. D. Smith, and M. S. Wire, "High speed data link between digital superconductor chips," Appl. Phys. Lett., vol. 80, pp. 3210-3212, April 2002.
8. J. H. Kang and S. B. Kaplan, "Current recycling and SFQ signal transfer in large scale RSFQ circuits," IEEE Trans. Appl Supercond., vol. 13, pp. 547-550, June 2003.
9. Y. Hashimoto, S. Yorozu, and T. Miyazaki, "Transmission of single flux quantum, between superconductor chips," Appl. Phys. Lett., vol. 86, pp. 072502-1-072502-3, February 2005.
10. Y. Hashimoto, S. Yorozu, and T. Satoh, "Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps," Appl. Phys. Lett., vol. 87, pp. 022502-022504, July 2005.
11. See for instance D. K. Brock, "Superconducting microelectronics: A digital RF technology for software radios," in Software Defined Radio: Enabling Technologies, W. Tuttlebee, Ed. West Sussex, England: John Wiley & Sons, Ltd, 2002, ch. 5, pp. 127-150.
12. K. E. Yokoyama, G. Akerling, A. D. Smith, and M. Wire, "Robust superconducting die attach process," IEEE Trans. Appl. Supercond., vol. 7, pp. 2631-2634, June 1997.
13. 2 Nb/AlOx/Nb fabrication processes," IEEE Trans. Appl Supercond., vol. 15, pp. 90-93, June 2005.
14. M. R. Rafique, H. Engseth, and A. Kidiyarova-Shevchenko, "Optimization of high frequency flip-chip interconnects for digital superconducting circuits," Supercond. Sci. Technol., vol. 19, pp. S354-S361, March 2006.
15. The voltage to be measured is amplified, by an Ithaco Model 1201 lownoise preamplifier, Ithaco, Inc. PO Box. 6437, Ithaca NY 14851-6437..