Characterization of HYPRES' 4.5 kA/cm2 & 8 kA/cm2 Nb/AlOx/Nb fabrication processes

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 2 PART I, 2005, Pages 90-93

  Yohannes, Daniel ^a,b   Sarwana, Saad ^b   Tolpygo, Sergey K ^b   Sahu, Anubhav ^a,b   Polyakov, Yuri A ^a   Semenov, Vasili K ^a  

^a STONY BROOK UNIVERSITY   (United States)

^b HYPRES INC   (United States)

Author keywords

Anodization; Critical current; Dielectric; Etching; Josephson junction (JJ); Lithography

Indexed keywords

ALUMINUM COMPOUNDS; CRITICAL CURRENTS; CURRENT DENSITY; DIELECTRIC DEVICES; DIELECTRIC MATERIALS; FABRICATION; INDUCTIVELY COUPLED PLASMA; LITHOGRAPHY; LOW TEMPERATURE EFFECTS; NIOBIUM; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; SILICA;

ANODIZATION; FABRICATION PROCESSES; JOSEPHSON JUNCTIONS (JJ); PARAMETRIC CONTROL MONITOR (PCM) TEST CHIPS;

JOSEPHSON JUNCTION DEVICES;

EID: 22044441620     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.849701     Document Type: Conference Paper

References (8)

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