High-speed interchip data transmission technology for superconducting multi-chip modules

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 I, 2001, Pages 731-734

  Gupta, D ^a   Li, W ^a   Kaplan, S B ^a   Vernik, I V ^a  

^a HYPRES INC   (United States)

Author keywords

Broadband communication; Multichip Modules; RSFQ; Superconducting devices

Indexed keywords

BROADBAND NETWORKS; DATA COMMUNICATION EQUIPMENT; LOGIC CIRCUITS; MULTICHIP MODULES; QUANTUM INTERFERENCE DEVICES; WAVEFORM ANALYSIS;

INTERCHIP DATA TRANSMISSION; PULSE RESURRECTION LOGIC; RAPID SINGLE FLUX QUANTUM LOGIC; SUPERCONDUCTING MULTICHIP MODULES;

SUPERCONDUCTING DEVICES;

EID: 0035268160     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919449     Document Type: Conference Paper

References (8)

1. Chip-to-chip communication using a single flux quantum pulse
2. Circuits for chip-to-chip transportation of bits from single flux quantum circuits
3. Josephson output interfaces for RSFQ circuits
4. Interface circuits for chip-to-chip data transfer at GHz rates
5. Multi-chip packaging for high speed superconducting circuits
6. On-chip clock technology for ultrafast digital superconducting electronics
7. RSFQ front-end for a software radio receiver
8. COOL-0: Design of an RSFQ subsystem for petaflops computing