X-ray diffraction analysis of the structure and residual stresses of W/Cu multilayers

Surface and Coatings Technology

Volumn 201, Issue 7 SPEC. ISS., 2006, Pages 4372-4376

  Girault, B ^a   Villain, P ^a   Le Bourhis, E ^a   Goudeau, P ^a   Renault, P O ^a  

^a UNIVERSITÉ DE POITIERS   (France)

Author keywords

Interfaces; Multilayer; Sputtering; Texture; Tungsten; X ray diffraction

Indexed keywords

COMPRESSIVE STRESS; COPPER; CRYSTAL ORIENTATION; RESIDUAL STRESSES; SPUTTERING; STRUCTURE (COMPOSITION); TEXTURES; TUNGSTEN; X RAY DIFFRACTION ANALYSIS;

CURVATURE METHOD; ION BEAM SPUTTERING; X-RAY REFLECTOMETRY DIAGRAMS;

MULTILAYERS;

COMPRESSIVE STRESS; COPPER; CRYSTAL ORIENTATION; MULTILAYERS; RESIDUAL STRESSES; SPUTTERING; STRUCTURE (COMPOSITION); TEXTURES; TUNGSTEN; X RAY DIFFRACTION ANALYSIS;

EID: 33751261892     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.08.034     Document Type: Article

References (11)

1. Thornton J.A., and Greene J.E. In: Bunshah R.F. (Ed). Handbook of Deposition Technologies for Films and Coatings. 2nd ed. (1994), Noyes, Park Ridge, NJ
2. Noyan I.C., and Cohen J.B. Residual Stress Measurement by Diffraction and Interpretation (1987), Springer, New York
3. Hauk V. Structural and Residual Stress Analysis by Non Destructive Methods: Evaluation, Application, Assessment (1997), Elsevier, Amsterdam
4. Huang H., and Spaepen F. Acta Mater. 48 (2000) 3251
5. Kalkmann A.J., Verbruggen A.H., and Jaussen G.L.A.M. Appl. Phys. Lett. 78 (2001) 2673
6. Schiotz J., Vegge T., Di Tolle F.D., and Jacobsen K.M. Phys. Rev., B 60 (1999) 11971
7. Ouyang G., Wang C.X., and Yang G.W. Appl. Phys. Lett. 86 (2005) 171914
8. Goudeau P., Villain P., Girardeau T., Renault P.-O., and Badawi K.-F. Scr. Mater. 50 (2004) 723
9. Lu J. Handbook of Measurement of Residual Stresses, Society for Experimental Mechanics (1996), Fairmont Press, Lilburn, GA
10. Ma C.-H., Huang J.-H., and Chen H. Thin Solid Films 446 (2004) 184
11. Floro J.A., Hearne S.J., Hunter J.A., Kotule P., Chason E., Seel S.C., and Thompson C.V. J. Appl. Phys. 89 (2001) 4886