Diffusion and segregation of substrate copper in electrodeposited Ni-Fe thin films

Journal of Alloys and Compounds

Volumn 443, Issue 1-2, 2007, Pages 81-86

  Ahadian, M M ^a   zad, A Iraji ^a   Nouri, E ^a   Ranjbar, M ^a   Dolati, A ^a  

^a SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Copper; Diffusion; Electrodeposition; Ni Fe; Surface segregation

Indexed keywords

LIPPMANN EQUATION; SURFACE OXIDATION;

ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; COPPER; ELECTRODEPOSITION; NICKEL ALLOYS; SECONDARY ION MASS SPECTROMETRY; SURFACE SEGREGATION; THIN FILMS;

METALLIC FILMS;

EID: 34447248792     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.10.048     Document Type: Article

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