An evaluation of electrolytic repair of discontinuous PVD copper seed layers in damascene vias

Journal of Applied Electrochemistry

Volumn 34, Issue 3, 2004, Pages 283-290

  Sukamto, J H ^a   Webb, E ^a   Andryushchenko, T ^a   Reid, J ^a  

^a Novellus Systems   (United States)

Author keywords

Chip; Copper; EDTA; Electrolytic; Integrated circuit; Pyrophosphate; Seed repair

Indexed keywords

ANODIC POLARIZATION; CHEMICAL VAPOR DEPOSITION; COPPER; CURRENT DENSITY; ELECTRODEPOSITION; INTEGRATED CIRCUITS; PH EFFECTS; PHYSICAL VAPOR DEPOSITION; PITTING; SURFACE ROUGHNESS; THIN FILMS;

PYROPHOSPHATE; SEED-REPAIR;

ELECTROLYTES;

EID: 1542786243     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JACH.0000015617.07734.ee     Document Type: Article

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