Study on embedding and integration of microsensors into metal structures for manufacturing applications

Journal of Manufacturing Science and Engineering

Volumn 129, Issue 2, 2007, Pages 416-424

  Cheng, Xudong ^a   Datta, Arindom ^a   Choi, Hongseok ^a   Zhang, Xugang ^a   Li, Xiaochun ^a  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDITION MONITORING; OPERATING COSTS; OPTIMIZATION; PROCESS CONTROL; QUALITY ASSURANCE; SILICON WAFERS; THERMOCOUPLES; ULTRASONIC WELDING;

METAL TOOLING STRUCTURES; RAPID TOOLING; TEMPORAL RESOLUTION; ULTRASONIC METAL WELDING (USMW);

MICROSENSORS;

EID: 34249878524     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2515456     Document Type: Article

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