Microfabrication and characterization of metal-embedded thin-film thermomechanical microsensors for applications in hostile manufacturing environments

Journal of Microelectromechanical Systems

Volumn 15, Issue 2, 2006, Pages 322-329

  Choi, Hongseok ^a   Datta, Arindom ^a   Cheng, Xudong ^a   Li, Xiaochun ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

Characterization; Hostile environment; Metal embedding; Microfabrication; Thin film microsensor

Indexed keywords

CALIBRATION; CHARACTERIZATION; DIELECTRIC MATERIALS; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; STAINLESS STEEL; STRAIN GAGES; THERMOCOUPLES; THIN FILM DEVICES;

HOSTILE MANUFACTURING; METAL EMBEDDING; MICROFABRICATION; THIN FILM MICROSENSORS;

MICROSENSORS;

EID: 33645772239     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.872235     Document Type: Article

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