Development of a multi-layer microelectrofluidic platform

Microsystem Technologies

Volumn 13, Issue 11-12, 2007, Pages 1509-1515

  Ng, S H ^a   Wang, Z F ^a   Tjeung, R T ^a   De Rooij, N F ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; GLASS TRANSITION; METALLIZING; MICROCHANNELS; POLYMETHYL METHACRYLATES;

EMBOSSING TEMPERATURE; HOT EMBOSSING; MICROELECTROFLUIDIC PLATFORM; POLYMER BONDING; SILVER EPOXY;

MICROFLUIDICS;

EID: 34249809750     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0341-6     Document Type: Conference Paper

References (9)

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