AlSiC for Optoelectronic Thermal Management and Packaging Designs

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 495-499

  Occhionero, Mark A ^a   Adams, Richard W ^a   Saums, Dave ^a  

^a Ceramics Process Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

STRESS COMPENSATION; THERMAL DESIGN; THERMAL MANAGEMENT; THERMOELECTRIC COOLERS (TEC);

ALUMINUM COMPOUNDS; DENSITY (SPECIFIC GRAVITY); METALLIC MATRIX COMPOSITES; MICROELECTRONICS; OPTOELECTRONIC DEVICES; POWER ELECTRONICS; RELIABILITY; THERMOELECTRICITY;

ELECTRONICS PACKAGING;

EID: 2342633278     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Robert Irvin, "Designing an Optoelectronic Package", Advancing Microelectronics Vol 29, No. 1, January/February, 2002.
2. Mark A. Occhionero, Richard W. Adams, Kevin P. Fennessy.and Glenn Sundberg, "AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability"
3. th.
4. Mark A. Occhionero, Robert A. Hay, Richard W. Adams, and Kevin P. Fennessy, "Aluminum Silicon Carbide (AlSiC) For Cost Effective Thermal Management And Functional Microelectronic Packaging Design Solutions" 12th European Microelectronics and Packaging Conference, June 7-9 1999, S10-04.