Silicon-based packaging platform with embedded solder interconnections for light emitting diode

Journal of Physics: Conference Series

Volumn 34, Issue 1, 2006, Pages 76-81

  Tsou, Chingfu ^a   Huang, Yu Sheng ^a   Lin, Che Wei ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744551646     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/34/1/013     Document Type: Article

References (7)

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6. Nakayama W 2000 Thermal Issues in microsystem packaging IEEE Trans. Advanced Packaging 23 602-607
7. Ramesham R and R Ghaffarian 2000 Challenges in interconnection and packaging of microelectomechanical systems (MEMS) Electronic Components and Technology Conf. Proc., Las Vegas, NV USA p 666-675